#FCMN2026
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    • Code of Conduct (PDF)
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    • Technical Program Schedule
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Technical Program

Technical Program Overview

The 2026 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (FCMN) will be held at the Monterey Marriott in Monterey, CA from March 16-19, 2026.

The FCMN will bring together scientists and engineers interested in all aspects of the characterization technology needed for nanoelectronic materials and device research, development, integration, and manufacturing. All approaches are welcome: chemical, physical, electrical, magnetic, optical, in situ, and real-time control and monitoring. The semiconductor industry is evolving rapidly:  the conference will highlight major issues and provide critical reviews of important materials and structure characterization and nearline/inline metrology methods, including hardware, data analysis, and AI and machine learning, as the industry both extends the technology deep into the nanoscale and increases the diversity of devices and systems.

The conference consists of formal invited presentation sessions and poster sessions for contributed papers and four (4) tutorial sessions. The poster papers cover new developments in materials and structure characterization/metrology down to the nanoscale. The conference began in 1995, and this meeting is the 16th in the series.

Technical Program Schedule

Monday, March 16 - Tutorials and Reception
Tuesday, March 17 - Technical Session, Poster Session, and Banquet
Wednesday, March 18 - Technical Session and Poster Session
Thursday, March 19 - Technical Session

Monday, March 16 - Tutorials and Reception

The FCMN 2026 organizers have scheduled four (4) limited seating tutorials. All will take place on Monday, March 16, 2026. Advance registration is required and space is limited to 20 people per tutorial. Registration will be on a first-come, first-served basis.

  • Registration: 12:00 – 7:00 PM
  • Reception and Registration: 7:00 – 9:00 PM

Tutorial Session II: Advanced Packaging

Time:  2:00-4:00 p.m.
Cost: $200
Presenter: Ofer Adan, Applied Materials

Tutorial Session I: Metrology Techniques

Time:  2:00-4:00 p.m.
Cost: $200
Presenters: Alain Diebold, University of Albany; Paul van der Heide, Imec

Tutorial Session III: XPS

Time:  4:30-6:30 p.m.
Cost: $200
Presenter: Paul van der Heide, Imec

Tutorial Session IV: TEM/STEM

Time:  4:30-6:30 p.m.
Cost: $200
Presenter: Michael Gribelyuk, IBM

Tuesday, March 17 - Technical Session, Poster Session, and Banquet

Registration:
7:00 AM – 8:30 AM

Conference Opening
9:00 AM
Alexander Liddle, Canon Nanotechnologies, Conference Co-Chair

Plenary I
Session Chairs: J. Alexander Liddle (Canon Nanotechnologies) and Markus Kuhn

9:15 AM
Robert Chau, XXX, Industry Roadmaps

10:00 AM
Coffee Break and Poster/Exhibit Viewing

Industry Trends
Session Chairs: Markus Kuhn (Rigaku) and Ofer Adan (Applied Materials)

10:30 AM
Todd Stievater (NRL) Passive Photonic Integrated Circuit Metrology

11:00 AM
Philip Wong (Stanford) New Devices and Future Technologies

11:30 AM
Alain Diebold (CNSE, U.Albany) 3D Metrology for GAA

12:00 PM – 1:30 PM
Lunch and Poster/Exhibit Viewing

Materials Characterization I
Session Chairs: Paul van der Heide (imec) and Eunpa Kim (Samsung)

1:30 PM
Andrei Kolmakov (NIST) XPS in Plasmas

2:00 PM
Koichiro Saga (SONY) Metal contamination in CMOS imagers/LA-ICPMS

2:30 PM
Cassandra Philips (Bruker) Nano-IR

3:00 PM
Coffee Break and Poster/Exhibit Viewing

Materials Characterization II
Session Chairs: Paul van der Heide (imec) and Troy Morrison (ThermoFisher)

3:30 PM
Alex Merkelov (imec) SIMS

4:00 PM
Umberto Celano (ASU) SPM Trends

4:30 PM
Robert Stroud (Tescan) Precession Electron Diffraction

Inline Metrologies I
Session Chairs: Alain Diebold (University of Albany) and Jin Zhang (Lam Research)

5:00 PM
Bryan Barnes (NIST) EUV Scatterometry

5:30 – 6:30 PM
Poster Session (with Drinks and Hors d’oeuvres)

7:00 PM
Banquet at Hotel

Wednesday, March 18 - Technical Session and Poster Session

Registration:
7:45 – 8:30 AM

Inline Metrologies I
Session Chairs: Alain Diebold (University of Albany) and Jin Zhang (Lam Research)

8:30 AM
Patrick Naulleau (EUV Tech) EUV Inspection and Metrology

9:00 AM
Jin Zhang (Lam Research) CDSAXS evaluation Journey at Lam Research

Inline Metrologies II
Session Chairs: Alain Diebold (University of Albany) and Steve Consiglio (TEL)

9:30 AM
Sarah Okada (Nova) Metrion SIMS

10:00 AM
Coffee Break and Poster/Exhibit Viewing

10:30 AM
Andy Humphris (Infinitessima) AFM

11:00 AM
Noriyuki Kawashima (Hitachi) Multi-beam SEM

11:30 – 1:00 PM
Lunch and Poster/Exhibit Viewing

Automation
Session Chairs: Tuyen Tran (Intel) and Ofer Adan (Applied Materials)

1:00 PM
Abhi Barve (Thermo Fisher Scientific) In-line TEM Workflow

1:30 PM
Aviram Tam (Applied Materials)

2:00 PM
TBD Tuyen to confirm

2:30 PM
Coffee Break and Poster/Exhibit Viewing

Virtual Metrology & Correlative Approaches
Session Chairs: Christina Hacker (NIST) and Eugen Foca (Zeiss)

3:00 PM
Maxime Besacier (Laboratoire des Technologies de la Microélectronique) Hybrid Metrology

3 :30 PM
Daniel Schmidt (IBM) Virtual and Hybrid Metrology

4:00 PM
Meghali Chopra (Sandbox Semiconductor)

4:30 – 6:00 PM
Poster Session (with Drinks and Hors d’oeuvres)

Thursday, March 19 - Technical Session

Registration:
7:00 AM – 8:30 AM

Plenary II
Session Chairs: J. Alexander Liddle (Canon Nanotechnologies) and Jin Zhang

8:30 AM
Gowri Kamarthy (Lam Research) Frontiers in Semiconductor Devices with 3D Integrations – Opportunities for process and metrology

Advanced Packaging
Session Chairs: Baohua Niu (Intel) and Alan Brodie (KLA)

9:15 AM
April Shuyan Zhang (TEL) Metrology for Hybrid Bonding

9:45 AM
Julius Hallstedt (Excillum) Defect Inspection in Advanced Packaging

10:15 AM
Coffee Break and Poster/Exhibit Viewing

10:45 AM
Ehrenfried Zscech (Malab) XCT

EUV and Beyond EUV
Session Chairs: Ye Feng (Intel) and Shinichi Ogawa (AIST)

11:15 AM
Takeo Watanabe (Hyogo University) BEUV (6.7) nm Lithography

11:45 AM
Doug Resnick (Canon Nanotechnologies) Nanoimprint Lithography

12:15 PM
Lunch and Poster/Exhibit Viewing

Novel methods to support novel CMOS memory and logic R&D
Session Chairs: Jin Zhang (Lam Research) and Ehrenfried Zscech (Malab)

1:30 PM
John Gaskins (Laser Thermal) Thermal Conductivity

2:00 PM
Jim Chambers (Nvidia) Advanced Fault Isolation

2:30 PM
Lars Mester (Attocube) Nano-optical imaging and spectroscopy of semicon materials – an s-SNOM & nano-IR overview

3:00 PM
Coffee Break

Novel methods to support beyond CMOS device R&D
Session Chairs:  Paul van der Heide (imec) and Jean-Paul Barnes (CEA-Leti)

3:30 PM
Mathieu Munsch (Qnami) Scanning Nitrogen Vacancy Magnetometry

4:00 PM
Stuart Parkin (PTB) Synchrotron based studies

Plenary III
Session Chairs: J. Alexander Liddle (Canon Nanotechnologies) and Alain Diebold

4:30 PM
Dan Hutcheson (TechInsights) Economics, Geopolitics, and the Future of the Semiconductor Industry

5:15 PM
Conference End

Invited Speakers

  • Bryan Barnes, NIST
  • Maxime Besacier, Director Laboratoire des technologies de la Microélectronique
  • Abhi Barve, Thermo Fisher Scientific
  • Umberto Celano, Associate Professor, Arizona State University
  • Jim Chambers, Nvidia
  • Robert Chau, Senior Vice President of Research, Natcast
  • Meghali Chopra, Sandbox Semiconductor
  • Alain Diebold, CNSE, University of Albany
  • John Gaskins, Laser Thermal
  • Julius Hållstedt, Head of Segment – Semi and Electronics, Excillum AB
  • G. Dan Hutcheson, Vice Chair of TechInsights Inc.
  • Andrew Humphris, CTO Infinitesima
  • Gowri Kamarthy Lam Research
  • Noriyuki Kawashima, Hitachi
  • Alex Merkelov, Principal Scientist, IMEC
  • Lars Mester, Attocube
  • Mathieu Munsch, Co-founder and CEO of Qnami
  • Patrick Naulleau, CEO EUV Tech
  • Sarah Okada, Director of Product Marketing, Nova
  • Stuart Parkin, Director at the Max Planck Institute of Microstructure Physics
  • Cassandra Philips, Bruker
  • Doug Resnick, Canon Nanotechnologies
  • Koichiro Saga, Distinguished Engineer at Sony Corporation
  • Daniel Schmidt, IBM
  • Todd Stievater, NRL
  • Robert Stroud, Tescan
  • Aviram Tam, Applied Materials
  • Takeo Watanabe, Hyogo University
  • Philip Wong, Stanford University
  • April Shuyan Zhang, TEL
  • Jin Zhang, Senior Engineering Manager, Lam Research
  • Ehrenfried Zscech, Professor MaLab

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Key Dates

Abstract Submission Deadline Extended to:
November 21, 2025

Author Notifications:
Mid-December

Early Registration Deadline:
January 16, 2026

Hotel Reservation Deadline:
January 16, 2026

Downloads

  • Code of Conduct (PDF)
  • Sponsor Form
  • Presentation & Poster Guidelines

AVS
Della Miller

Event Manager
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Chico, CA 95973
(530) 896-0477
della@avs.org

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