#FCMN2026
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  • Overview
    • Code of Conduct (PDF)
    • Committee
    • FCMN Archives (Past Publications & Talks)
  • Abstracts
  • Hotel/Travel
    • Airports
    • Conference Venue
    • Hotel Reservations
    • Things To Do
    • Travel Requirements (Visa)
  • Registration
  • Program
    • Invited Speakers
    • Presentation & Poster Guidelines
    • Technical Program Schedule
    • Tutorials
    • Posters
  • Sponsors/Exhibitors
    • Sponsor & Exhibitor Form (PDF)
    • Sponsor & Exhibitor Form (Online)

Technical Program

Technical Program Overview

The 2026 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (FCMN) will be held at the Monterey Marriott in Monterey, CA from March 16-19, 2026.

The FCMN will bring together scientists and engineers interested in all aspects of the characterization technology needed for nanoelectronic materials and device research, development, integration, and manufacturing. All approaches are welcome: chemical, physical, electrical, magnetic, optical, in situ, and real-time control and monitoring. The semiconductor industry is evolving rapidly:  the conference will highlight major issues and provide critical reviews of important materials and structure characterization and nearline/inline metrology methods, including hardware, data analysis, and AI and machine learning, as the industry both extends the technology deep into the nanoscale and increases the diversity of devices and systems.

The conference consists of formal invited presentation sessions and poster sessions for contributed papers and four (4) tutorial sessions. The poster papers cover new developments in materials and structure characterization/metrology down to the nanoscale. The conference began in 1995, and this meeting is the 16th in the series.

Technical Program Schedule

Monday, March 16 - Tutorials and Reception
Tuesday, March 17 - Technical Session, Poster Session, and Banquet
Wednesday, March 18 - Technical Session and Poster Session
Thursday, March 19 - Technical Session
Posters

Monday, March 16 - Tutorials and Reception

The FCMN 2026 organizers have scheduled four (4) limited seating tutorials. All will take place on Monday, March 16, 2026. Advance registration is required and space is limited to 20 people per tutorial. Registration will be on a first-come, first-served basis.

  • Registration: 12:00 – 7:00 PM
  • Reception and Registration: 7:00 – 9:00 PM

Tutorial Session I: Metrology Techniques

Time:  2:00-4:00 p.m.
Cost: $200
Presenters: Alain Diebold, University of Albany; Paul van der Heide, Imec

Tutorial Session II: Advanced Packaging

Time:  2:00-4:00 p.m.
Cost: $200
Presenter: Ofer Adan, Applied Materials

Tutorial Session III: XPS

Time:  4:30-6:30 p.m.
Cost: $200
Presenter: Paul van der Heide, Imec

Tutorial Session IV: TEM/STEM

Time:  4:30-6:30 p.m.
Cost: $200
Presenter: Michael Gribelyuk, IBM

Tuesday, March 17 - Technical Session, Poster Session, and Banquet

Registration:
7:00 AM – 8:30 AM

Conference Opening
9:00 AM
Alexander Liddle, Canon Nanotechnologies, Conference Co-Chair

Plenary I
Session Chairs: J. Alexander Liddle (Canon Nanotechnologies) and Markus Kuhn (Rigaku)

9:15 AM
Robert Chau (AMD) Semiconductor and Packaging Innovations for Continued Compute and AI Advancement in the Next Decade

10:00 AM
Coffee Break and Poster/Exhibit Viewing

Industry Trends
Session Chairs: Ofer Adan (Applied Materials) and Jaehyun Kim (SK Hynix)

10:30 AM
Todd Stievater (NRL) Passive Photonic Integrated Circuit Metrology

11:00 AM
Philip Wong (Stanford) Beyond the Exit of the Device Miniaturization Tunnel

11:30 AM
Alain Diebold (CNSE, U. Albany) Mueller Matrix Spectroscopic Ellipsometry based Scatterometry of Nanosheet Structures for GAA Transistors using a Hybrid Metrology Approach

12:00 PM – 1:30 PM
Lunch and Poster/Exhibit Viewing

Materials Characterization I
Session Chairs: Paul van der Heide (imec) and Eunpa Kim (Samsung)

1:30 PM
Andrei Kolmakov (NIST) Plasma XPS: a New Operando Metrology for Semiconductor Process Development and Control

2:00 PM
Koichiro Saga (SONY) Influence of metallic contamination on CMOS image sensors and analytical techniques

2:30 PM
Cassandra Philips (Bruker) Novel Applications of Nanoscale IR Spectroscopy Coupled with AFM for Semiconductor Metrology

3:00 PM
Coffee Break and Poster/Exhibit Viewing

Materials Characterization II
Session Chairs: Paul van der Heide (imec) and Troy Morrison (ThermoFisher)

3:30 PM
Alex Merkulov (imec) Improving the carbon detection limit with Secondary Ion Mass Spectrometry (SIMS)

4:00 PM
Umberto Celano (ASU) Who Needs Electrical Back-Contacts After All?

4:30 PM
Daniel Němeček (Tescan) Advances in 4D-STEM for Applications in Phase Analysis and Strain Engineering

Inline Metrologies I
Session Chairs: Alain Diebold (University of Albany) and Jin Zhang (Lam Research)

5:00 PM
Bryan Barnes (NIST) Harnessing the extreme ultraviolet for critical dimension metrology

5:30 PM
Poster Session

7:00 PM
Banquet at Hotel

Wednesday, March 18 - Technical Session and Poster Session

Registration:
7:45 – 8:30 AM

Inline Metrologies I
Session Chairs: Alain Diebold (University of Albany) and Jin Zhang (Lam Research)

8:30 AM
Patrick Naulleau (EUV Tech) Hybrid Metrology for Hot Spot Prediction in Post-Etch Patterning

9:00 AM
Jin Zhang (Lam Research) CDSAXS evaluation Journey at Lam Research

Inline Metrologies II
Session Chairs: Alain Diebold (University of Albany) and Steve Consiglio (TEL)

9:30 AM
Sarah Okada (Nova) Impact Assessment of In-line SIMS Utilization on Logic Device Performance

10:00 AM
Coffee Break and Poster/Exhibit Viewing

10:30 AM
Andy Humphris (Infinitesima) High Speed AFM as an Enabling Technology for Next Generation Semiconductor Devices

11:00 AM
Kengo Goto (Hitachi) Multibeam inspection tool development for detecting below 10 nm physical defects

11:30 AM – 1:00 PM
Lunch and Poster/Exhibit Viewing

Automation
Session Chairs: Tuyen Tran (Intel) and Ofer Adan (Applied Materials)

1:00 PM
Sanjay Yedur (Thermo Fisher Scientific) Workflow Automation For High Volume TEM Data Production

1:30 PM
Aviram Tam (Applied Materials)

2:00 PM
YoungSeok Kim (Samsung) Spectrum-to-structure Hybrid Metrology: SEM Referenced Model Guided M/L of 3D Profiling from SE and Xray Signals

2:30 PM
Coffee Break and Poster/Exhibit Viewing

Virtual Metrology & Correlative Approaches
Session Chairs: Christina Hacker (NIST) and Eugen Foca (Zeiss)

3:00 PM
Maxime Besacier (Laboratoire des Technologies de la Microélectronique) Hybrid Metrology Assisted by Machine Learning at Nanometer Scale

3 :30 PM
Arvinder Sandhu (ASU)

4:00 PM
Meghali Chopra (Sandbox Semiconductor) Hybrid Metrology for Hot Spot Prediction in Post-Etch Patterning

4:30 – 6:00 PM
Poster Session (with Drinks and Hors d’oeuvres)

Thursday, March 19 - Technical Session

Registration:
7:00 AM – 8:30 AM

Plenary II
Session Chairs: J. Alexander Liddle (Canon Nanotechnologies) and Jin Zhang (Lam Research)

8:30 AM
Gowri Kamarthy (CVP, Lam Research) Frontiers in Semiconductor Devices with 3D Integrations – Opportunities for process and metrology

Advanced Packaging
Session Chairs: Baohua Niu (Intel) and Alan Brodie (KLA)

9:15 AM
April Shuyan Zhang (TEL) Addressing Metrology Challenges in Hybrid Bonding: An Overview of Tokyo Electron’s X-ray Imaging Program Focused on Overlay and Defects

9:45 AM
Julius Hallstedt (Excillum) From Wafer to Package: High Performance X-Ray Sources Driving Semiconductor Progress

10:15 AM
Coffee Break and Poster/Exhibit Viewing

10:45 AM
Ehrenfried Zschech (BTU Cottbus) Combined Acoustic and X-Ray Microscopy for Advanced Packaging Metrology and Defect Inspection

EUV and Beyond EUV
Session Chairs: Ye Feng (Intel) and Shinichi Ogawa (AIST)

11:15 AM
Takeo Watanabe (Hyogo University) Metrology for EUV Lithography at NewSUBARU Synchrotron Light Facility

11:45 AM
Doug Resnick (Canon Nanotechnologies) Metrology Requirements for Nanoimprint Lithography

12:15 PM
Lunch and Poster/Exhibit Viewing

Novel methods to support novel CMOS memory and logic R&D
Session Chairs: Jin Zhang (Lam Research) and Ehrenfried Zscech (Malab)

1:30 PM
John Gaskins (Laser Thermal) Cross-Validated Anisotropic Thermal Conductivity Metrology of AlN Films

2:00 PM
Jim Chambers (Nvidia) Failure Analysis in the AI Era: Ensuring Reliability at Scale

2:30 PM
Lars Mester (Attocube) Nano-optical imaging and spectroscopy of semicon materials – an s-SNOM & nano-IR overview

3:00 PM
Coffee Break

Novel methods to support beyond CMOS device R&D
Session Chairs:  Paul van der Heide (imec) and Jean-Paul Barnes (CEA-Leti)

3:30 PM
Mathieu Munsch (Qnami) Nanoscale Quantum Sensing for Spintronics and Electronics

4:00 PM
Stuart Parkin (PTB) Synchrotron based studies

Plenary III
Session Chairs: J. Alexander Liddle (Canon Nanotechnologies) and Alain Diebold (University of Albany)

4:30 PM
Dan Hutcheson (TechInsights) Moore’s Law is dead. Long live Moore’s Law

5:15 PM
Conference End

Posters

View FCMN 2026 Posters (subject to change)

Invited Speakers

  • Bryan Barnes, NIST
  • Maxime Besacier, Director Laboratoire des technologies de la Microélectronique
  • Umberto Celano, Associate Professor, Arizona State University
  • Jim Chambers, Nvidia
  • Robert Chau, Process Tech Architect, AMD
  • Meghali Chopra, Sandbox Semiconductor
  • Alain Diebold, CNSE, University of Albany
  • John Gaskins, Laser Thermal
  • Julius Hållstedt, Head of Segment – Semi and Electronics, Excillum AB
  • G. Dan Hutcheson, Vice Chair of TechInsights Inc.
  • Andrew Humphris, CTO, Infinitesima
  • Gowri Kamarthy, CVP, Lam Research
  • Noriyuki Kawashima, Hitachi
  • YoungSeok Kim, Samsung
  • Andrei Kolmakov, NIST
  • Alex Merkelov, Principal Scientist, IMEC
  • Lars Mester, Attocube
  • Mathieu Munsch, Co-founder and CEO of Qnami
  • Patrick Naulleau, CEO EUV Tech
  • Daniel Nemecek, Tescan
  • Sarah Okada, Director of Product Marketing, Nova
  • Stuart Parkin, Director at the Max Planck Institute of Microstructure Physics
  • Cassandra Philips, Bruker
  • Doug Resnick, Canon Nanotechnologies
  • Koichiro Saga, Distinguished Engineer at Sony Corporation
  • Todd Stievater, NRL
  • Aviram Tam, Applied Materials
  • Takeo Watanabe, Hyogo University
  • Philip Wong, Stanford University
  • April Shuyan Zhang, TEL
  • Sanjay Yedur, Thermo Fisher Scientific
  • Jin Zhang, Senior Engineering Manager, Lam Research
  • Ehrenfried Zschech, BTU Cottbus

Platinum Sponsors

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Key Dates

Abstract Submission Deadline Extended to:
November 21, 2025

Author Notifications:
Mid-December

Early Registration Deadline:
January 16, 2026

Hotel Reservation Deadline:
January 16, 2026

Downloads

  • Code of Conduct (PDF)
  • Sponsor Form
  • Presentation & Poster Guidelines

AVS
Della Miller

Event Manager
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(530) 896-0477
della@avs.org

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