Program Co-Chairs:
- Alain Diebold, University of Albany
- Markus Kuhn, Rigaku
- Alexander Liddle, NIST
- Paul van der Heide, imec
- Jin Zhang, Lam Research
Program Committee
- Ofer Adan, Applied Materials
- Jean-Paul Barnes, CEA-Leti
- Alan Brodie, KLA-Tencor
- Steve Consiglio, TEL Technology Center
- Michael Current, Current Scientific
- Frank de Jong, Thermo Fisher
- Ye Feng, Intel
- Eugen Foca, Zeiss
- Christina Hacker, NIST
- Ajey Jacob, University of Southern California
- Eunpa Kim, Samsung
- Shunsuke Koshihara, Hitachi High-Tech Corporation
- Baohua Niu, Intel TD Failure Analysis and Defect Metrology
- Shinichi Ogawa, AIST
- David Seiler
- Ehrenfried Zschech, Malab